There are many use cases of SenseAI in the semiconductor industry such as Failure Analysis, R&D and Q&A.
Techniques such as subsampled 2D-STEM and 4D-STEM can be used for rapid and detailed atomic-resolution imaging, speeding up volumetric analyses such as FIB-SEM. It can also help to accelerate defect mapping, interface analysis and spectroscopic imaging (e.g. EDS) and other STEM methods. The ability to see what you’re doing in real-time can significantly speed up workflows.
For Q&A, SEM and other analytical techniques (such as Atomic Probe Microscopy) can be significantly speeded up (over 10x) and with less data to achieve more sample coverage and faster results with less noise.
